- RS Stock No.:
- 182-2279
- Mfr. Part No.:
- 74221-101LF
- Manufacturer:
- Amphenol Communications Solutions
Temporarily out of stock - back order for despatch 22-07-2024, delivery within 2 working days
Price Each (On a Reel of 250)
€23.713
(exc. VAT)
€29.167
(inc. VAT)
units | Per unit | Per Reel* |
250 + | €23.713 | €5,928.25 |
*price indicative |
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- RS Stock No.:
- 182-2279
- Mfr. Part No.:
- 74221-101LF
- Manufacturer:
- Amphenol Communications Solutions
Technical data sheets
Legislation and Compliance
- COO (Country of Origin):
- US
Product Details
High density, high speed, discrete contact, array connector
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
400 Position BGA Receptacle, 4 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free
Specifications
Attribute | Value |
---|---|
Package Type | BGA |
IC Socket Type | Prototyping Socket |
Gender | Female |
Number of Contacts | 400 |
Contact Material | Copper Alloy |
Contact Plating | Gold |
Current Rating | 450.0mA |
Socket Mounting Type | Surface Mount |
Device Mounting Type | Surface Mount |
Voltage Rating | 200.0 V |
Termination Method | Through Hole |
Housing Material | Liquid Crystal Polymer |