RS PRO Silicone Thermal Grease, 2W/m·K
- RS Stock No.:
- 180-5314
- Manufacturer:
- RS PRO
Discontinued product
- RS Stock No.:
- 180-5314
- Manufacturer:
- RS PRO
Technical data sheets
Legislation and Compliance
Product Details
RS PRO 18053142-Part Dispensible Thermal Gap Filler, 2.0W/mK Surface cure thermal interface paste specially designed to resist pumping out from the bond line. It can be applied using industrial dispensing equipment or via screen/stencil printing techniques.
Long term thermal stability,
recommended for applications with rapid temperature cycling,
easily dispensable,
fast curing time (when heated).
Applications
Automotive ECU (electronic control units), power supplies, microprocessors, displays and consumer electronics
recommended for applications with rapid temperature cycling,
easily dispensable,
fast curing time (when heated).
Applications
Automotive ECU (electronic control units), power supplies, microprocessors, displays and consumer electronics
Specifications
Attribute | Value |
|---|---|
| Thermal Conductivity | 2W/m·K |
| Material | Silicone |
| Maximum Operating Temperature | +200°C |
| Minimum Operating Temperature | -60°C |
| Pack Size | 200 ml |
| Physical State | Paste |
| Operating Temperature Range | -60 → +200 °C |