Heat curable surface mount adhesive,10ml

  • RS Stock No. 567-581
  • Manufacturer RS PRO
Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): GB
Product Details

RS Pro Heat Cured SMT Adhesive

Our RS Pro range of heat cured SMT Adhesive is a one part thixotropic paste adhesive that will provide a great bond for the protection of electronic components by either dipping or “glob topping. It packs a punch in great “green strength” or stickiness to ensure that the components do not move during handling. With the adhesive being supplied in a syringe, it makes for effortless mounting.

We recommend using a dispenser needle with this product. See below for compatible needles.

Features and benefits –

• High “green strength” (stickiness) for easy mounting.
• Resistant to PCB cleaning solvents to ensure components stay in place.
• Excellent electrical characteristics
• Long term stability after cure cycle
• Flexible in a cured state to ensure components are not stressed.
• Medium strength to allow for easy components removal for reworking.
• Thixotropic properties give a high dot profile.
• Working temperature after curing of -40°C to +130°C
• Non toxic
• 1% water absorption rate after 3 hours in boiling water so rest assure all moisture sensitive devices will be safe.

Looking for a dispenser needle?

General purpose dispenser – 669-3869
For a more precise dispenser needle – 505-7786

FAQ (Frequently Asked Questions)

Will this adhesive keep moisture away from my sensitive components?
Yes. This product is designed to be “glob topped” onto your PCB to protect your valuable components.

How fast will it cure?
This depends on the temperature you cure it at. The higher the temperature the faster it cures. We recommend the highest temperature you cure at is 120°C. At 120°C it will cure in 20 minutes.

RS PRO

RS PRO is our own brand range and brings you a wide range of high-quality, great value products offering you more choice. Trusted by engineers all over the world, every part of every RS PRO product has been rigorously tested against demanding industry standards; they’re only given the RS PRO Seal of Approval if we’re confident of their exceptional quality, which means you can be confident too.

Specifications
Attribute Value
Adhesive Type Acrylic Adhesive
Colour Red
Package Type Syringe
Package Size 10 ml
Cure Time 20 (120°C) min, 40 (100°C) min, 60 (90°C) min
Viscosity Measurement 1450mPa/s
Maximum Operating Temperature +140°C
Specific Gravity 1.16
Chemical Composition Aliphatic Amines, Epoxy Resin, Neopentyl Glycol Diglycidyl Ether
Special Features Solvent Resistant
Stock check temporarily unavailable - call for stock availability
Unit of sale: Each
16.71
(exc. VAT)
20.22
(inc. VAT)
units
Per unit
1 - 5
€16.71
6 - 14
€16.05
15 +
€15.70
Related Products
The required amount of putty is torn from ...
Description:
The required amount of putty is torn from the strip and kneaded by hand until the blue and white strip has turned a uniform colour Gel time 6 minutes at +20°CWill bond and seal a wide variety of materials Can ...
The ITW 500g Devcon epoxy adhesive is a ...
Description:
The ITW 500g Devcon epoxy adhesive is a versatile, durable, two-part epoxy compound for maintenance and repair of a broad range of equipment It provides non-rusting surfaces repairs and rebuilds worn shafts, pumps and impellers. Maximum operating temperature of 177°CPot ...
Versatile durable two-part epoxy compounds for maintenance and ...
Description:
Versatile durable two-part epoxy compounds for maintenance and repair of a broad range of equipment Cured repairs can be drilled, tapped, machined or painted which has long-life protection against abrasion, corrosion and chemicals. Repairs pumps, valves, flanges and seals Prevents ...
The Electrolube 250g epoxy resin is a flame ...
Description:
The Electrolube 250g epoxy resin is a flame retardant, thermally conductive, 2-part potting and encapsulating compound This technology used is of the ’clean’ type, leading to relatively low toxicity fumes and low smoke emission. Casting compound for encapsulating electronic assemblies ...