TE Connectivity, Economy 800 2.54mm Pitch Vertical 40 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A

Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
Product Details

TE Connectivity PCB DIP Sockets with Stamped and Formed Contacts - Economy 800 Series

Economy 800 series PCB DIP sockets with open ladder style frame and 2.54mm centerline. These PCB DIP IC sockets mount vertically and have stamped and formed gold plated contacts with four fingered mating.

Precision four-finger inner contact provides concentric funnel entry for easy flat and round lead insertion
"X" and "Y" Stackable
Open ladder for cooling, cleaning and inspection
Low profile
Accommodates rectangular or round IC leads
Non-wicking, closed bottom sleeve gives 100% protection against flux and solder contamination
Recognized under the Component Program of Underwriters Laboratories, Inc. file No. E111362
Beryllium copper inner contact for maximum mechanical and electrical performance

Approvals

UL E111362

Specifications
Attribute Value
Number of Contacts 40
Mounting Type Through Hole
Pin Type Stamped
Pitch 2.54mm
Row Width 15.24mm
Frame Type Open Frame
Termination Method Solder
Contact Plating Gold, Tin
Current Rating 3A
Orientation Vertical
Length 50.8mm
Width 4.57mm
Depth 17.78mm
Dimensions 50.8 x 4.57 x 17.78mm
Series Economy 800
Contact Material Beryllium Copper
Maximum Operating Temperature +105°C
Housing Material PCT
Minimum Operating Temperature -55°C
864 In stock for delivery within 2 working days
Unit of sale: Each (In a Tube of 12)
3.36
(exc. VAT)
4.07
(inc. VAT)
units
Per unit
Per Tube*
12 - 168
€3.36
€40.32
180 - 588
€2.79
€33.48
600 - 1188
€2.42
€29.04
1200 - 2988
€2.218
€26.616
3000 +
€1.95
€23.40
*price indicative
Related Products
A range of universal adaptors from Seeit designed ...
Description:
A range of universal adaptors from Seeit designed to convert to DIP packages ADA-SOIC16-150: SOP8/14/16 to DIP16 (454-6803)ADA-QFN28: MLF28/QFN28 to DIP28 (919-5536)ADA-SSOP28: SSOP8/14/16/28 to DIP28 (919-5520)ADA-SO28-300: SOP18/28 to DIP28 (509-6292)ADA-PLCC32-32: PLCC32 to DIP28 / DIP32 (454-6819)ADA-PLCC32: ...
A range of PLCC surface mount sockets with ...
Description:
A range of PLCC surface mount sockets with phosphor bronze contacts The contacts are set on a 0.1in. grid to match JEDEC patterns. Polarising feature ensures correct insertion of chip carriers. Suitable extraction tool (stock no. 480-3005). Low profile design, ...
TE Connectivity’s (TE) new LGA 3647 socket solution ...
Description:
TE Connectivity’s (TE) new LGA 3647 socket solution meets the next-generation designs of Intel’s new CPU processors for higher performance and better system scaling As one of a limited number of suppliers of this technology, TE is your dependable socket ...
(mΩ) Plastic leaded chip carrier (PLCC) sockets with ...
Description:
(mΩ) Plastic leaded chip carrier (PLCC) sockets with through hole solder tails2.54mm grid matching JEDEC patterns Stand - offs aid cleaning and heat dissipation Suitable extraction tool (stock no. 480-3005)Insulation material: Glass filled polyester Insulation resistance 1000MΩTemperature range -50 to ...