Yamaichi 0.5mm Pitch 100 Way SMT QFP Test Sockets

  • RS Stock No. 372-3431
  • Mfr. Part No. IC51-1004-809
  • Manufacturer Yamaichi
Technical data sheets
Legislation and Compliance
RoHS Status: Not Applicable
Product Details

QFP Test Sockets - Clamshell

Clamshell test sockets for QFP's
Spring loaded hinged lid latches to retain ICs
Easy, repeatable access for test purposes
High reliability, durability and temperature range
Range supports a variety of pitches
Body material Glass Filled PES; Glass Filled PEI
Contact material Beryllium Copper
Contact plating Gold
Insulation Resistance 1000 MΩ (At 500 Vdc)
Contact resistance 30mΩ (at 10mA)
Operating temperature -55°C to 170°C
Durability 10000 insertions

Specifications
Attribute Value
Package Type QFP
Gender Female
Number of Contacts 100
Pitch 0.5mm
Body Orientation Straight
Contact Material Beryllium Copper
Contact Plating Gold over Nickel
Socket Mounting Type Surface Mount
Termination Method Solder
Housing Material PEI, PES, PSU
5 Within 2 working day(s) (EU stock)
11 Within 5 working day(s) (EU stock)
Unit of sale: Each
267.29
(exc. VAT)
328.77
(inc. VAT)
units
Per unit
1 - 9
€267.29
10 - 24
€227.22
25 +
€154.85
Related Products
A range of universal adaptors from Seeit designed ...
Description:
A range of universal adaptors from Seeit designed to convert to DIP packages ADA-SOIC16-150: SOP8/14/16 to DIP16 (454-6803)ADA-QFN28: MLF28/QFN28 to DIP28 (919-5536)ADA-SSOP28: SSOP8/14/16/28 to DIP28 (919-5520)ADA-SO28-300: SOP18/28 to DIP28 (509-6292)ADA-PLCC32-32: PLCC32 to DIP28 / DIP32 (454-6819)ADA-PLCC32: ...
Textool™ test & burn-in SOIC sockets with a ...
Description:
Textool™ test & burn-in SOIC sockets with a compact envelope design and side to side stackability to maximise board density The lid of these Textool™ test & burn-in SOIC sockets applies 80 gram normal force per lead for maximum electrical ...
PLCC test and burn-in sockets to enable component ...
Description:
PLCC test and burn-in sockets to enable component testing during operation in live-bug orientation Two-point contacts and the larger contact width ensure high reliability and at low cost due to selective gold plating. Body material Polyphenylene Sulphide (PPS)(Upper); Polyetherimide (PEI) ...
TSOP-I Package Socket (05 mm)Open-top structureIC package can ...
Description:
TSOP-I Package Socket (05 mm)Open-top structureIC package can be inserted/removed by raising/lowering cover Unique design provides outstanding contact reliability Lever-operated, so little force is required, and the product's durability is enhanced.