STMicroelectronics 3-Axis Surface Mount Accelerometer & Gyroscope, LGA-14L, I2C, SPI, 14-Pin
- RS Stock No.:
- 261-4177P
- Mfr. Part No.:
- ISM330ISTR
- Manufacturer:
- STMicroelectronics
Temporarily out of stock - back order for despatch 27-09-2024, delivery within 2 working days
Added
Price Each (Supplied on a Reel) Quantities below 150 on continuous strip
€4.68
(exc. VAT)
€5.76
(inc. VAT)
| Units | Per unit |
| 10 - 99 | €4.68 |
| 100 - 249 | €4.45 |
| 250 - 499 | €4.23 |
| 500 + | €4.01 |
- RS Stock No.:
- 261-4177P
- Mfr. Part No.:
- ISM330ISTR
- Manufacturer:
- STMicroelectronics
Technical data sheets
Legislation and Compliance
- COO (Country of Origin):
- PH
Product Details
iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope with embedded ISPU - intelligent sensor processing unit
The ISM330IS is a system-in-package featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope, boosting performance at 0.59 mA in high-performance mode and enabling always-on low-power features for optimal motion results in industrial and IoT solutions.
The ISM330IS has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
The ISM330IS features programmable interrupts and an on-chip sensor hub which includes up to 6 sensors: the internal accelerometer & gyroscope and 4 external sensors.
The ISM330IS has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
The ISM330IS features programmable interrupts and an on-chip sensor hub which includes up to 6 sensors: the internal accelerometer & gyroscope and 4 external sensors.
The ISM330IS embeds a new ST category of processing, ISPU (intelligent sensor processing unit) to support real-time applications that rely on sensor data. The ISPU is an ultra-low-power, high-performance programmable core which can execute signal processing and AI algorithms in the edge. The main benefits of the ISPU are C programming and an enhanced ecosystem with libraries and 3rd party tools/IDE.
Its optimized ultra-low-power hardware circuitry for real-time execution of the algorithms is a state-of-the-art feature for any wireless sensor node from small equipment or accessories to enterprise solutions for Industry 5.0 (for example, anomaly detection, asset tracking, factory automation, and so forth).
The ISM330IS is available in a plastic land grid array (LGA) package.
Its optimized ultra-low-power hardware circuitry for real-time execution of the algorithms is a state-of-the-art feature for any wireless sensor node from small equipment or accessories to enterprise solutions for Industry 5.0 (for example, anomaly detection, asset tracking, factory automation, and so forth).
The ISM330IS is available in a plastic land grid array (LGA) package.
Key features
- 3-axis accelerometer with selectable full scale: ±2/±4/±8/±16 g
- 3-axis gyroscope with selectable full scale: ±125/±250/±500/±1000/±2000 dps
- Embedded ISPU: ultra-low-power, high-performance programmable core to execute signal processing and AI algorithms in the edge for a seamless digital-life experience
- Low-power consumption: 0.59 mA in high-performance mode, 0.46 mA in low-power mode (gyroscope + accelerometer only, ISPU not included)
- Low noise: 70 μg/√Hz in high-performance mode
- Sensor hub feature to efficiently collect data from additional external sensors (up to 4 external sensors)
- SPI / I²C serial interface
- Analog supply voltage: 1.71 V to 3.6 V with independent IO supply (1.62 V)
- Temperature range from -40 to +85 °C
- Embedded temperature sensor
- Compact footprint: 2.5 mm x 3 mm x 0.83 mm
- ECOPACK and RoHS compliant
Specifications
Attribute | Value |
|---|---|
| Sensor Type | Accelerometer, Gyroscope |
| Number of Axis | 3 |
| Technology | Accelerometer |
| Mounting Type | Surface Mount |
| Interface Type | I2C, SPI |
| Package Type | LGA-14L |
| Pin Count | 14 |