Activated No-Clean solder alloy with incorporated resinous flux.
Designed for industrial applications in the electronics and connector industries.
Excellent wetting on tin-plated substrates.
Generates minimal fumes and residue.
Chlorine content: 1.1 %
Class: J-STD-004 ROM1
Attribute | Value |
---|---|
Model Number | SN60 PB |
Wire Diameter | 0.7mm |
Percent Lead | 40% |
Product Form | Wire |
Melting Point | +183°C |
Percent Tin | 60% |
Flux Type | Rosin |
Product Weight | 500g |
Flux Content Percent | 2% |