Multicore 1.2mm Wire Lead solder, +183°C Melting Point

  • RS Stock No. 554-939
  • Mfr. Part No. 291482
  • Manufacturer Multicore
Technical data sheets
Legislation and Compliance
Non Compliant
COO (Country of Origin): MY
Product Details

'Savbit’® Solder

Contains a small amount of copper which reduces wear of soldering iron bits and enables fine copper wires to be soldered more efficiently.

5 cores of Ersin® flux
Reel weight 500 g

Standards

Conforms to BS441 Type 1, DTD599A and DIN8516.

Note

REACH Regulation (EC) No 1907/2006
Substances restricted under REACH Annex XVII
This product contains a substance that is restricted under Annex XVII
of the REACH Regulation.
It is restricted to professional users and cannot be supplied to the
general public (non-trade customers).
Please refer to the Safety Data Sheet (SDS) for more information.

Approvals

BS441; Type 1; DTD 599A; DIN 8516

Standards

Conforms to BS441 Type 1, DTD599A and DIN8516

Specifications
Attribute Value
Model Number 362
Wire Diameter 1.2mm
Percent Lead 48.5%
Product Form Wire
Melting Point +183°C
Percent Tin 50%
Flux Type Rosin Based
Product Weight 500g
Flux Content Percent 3%
Percent Copper 1.5%
312 In stock for delivery within 2 working days
Unit of sale: 1 Reel of 500 Gram(s)
40.70
(exc. VAT)
50.06
(inc. VAT)
Reel(s)
Per Reel
Per unit*
1 - 9
€40.70
€0.081
10 - 19
€39.07
€0.078
20 - 49
€37.86
€0.076
50 +
€34.59
€0.069
*price indicative
Related Products
Solder wire 99C Crystal 511No-Clean solder wire with ...
Description:
Solder wire 99C Crystal 511No-Clean solder wire with incorporated flux and clear residue.High speed soldering, range of activities suitable for all applications.Constant heat, low spatter.
Activated No-Clean solder alloy with incorporated resinous fluxDesigned ...
Description:
Activated No-Clean solder alloy with incorporated resinous fluxDesigned for industrial applications in the electronics and connector industries.Excellent wetting on tin-plated substrates.Generates minimal fumes and residue.Chlorine content: 1.1 %Class: J-STD-004 ROM1.
A tin/lead solder which exhibits a very sharp ...
Description:
A tin/lead solder which exhibits a very sharp (eutectic) melting transition and is ideal for repairs on fabricated boards Thermal damage to components can be minimised due to lower temperatures5 cores of Ersin® flux.
Ideal for jointing aluminium, tin-plated brass, nickel, copper ...
Description:
Ideal for jointing aluminium, tin-plated brass, nickel, copper or stainless steel but is not suitable for electrical joints Soft solder with low melting point which enables it to be used in place of previously brazed/welded joints4 cores of Alu-Sol® flux. ...