MG Chemical Epoxy Thermal Adhesive, 15 min @ +65 °C, 4 (Room Temperature) h Cure, 25 ml Syringe

  • RS Stock No. 181-0363
  • Mfr. Part No. 8329TFF-25ML
  • Manufacturer MG Chemical
Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): CA
Product Details

8329TFF is a thermally conductive, fast-cure two-part epoxy adhesive. It is off-white, smooth, thixotropic, and bonds well to a wide variety of substances. It is also flame retardant. For a 1 mL quantity, a minimal service cure can be achieved in 15 minutes at room temperature, and a full cure in 4 hours.
This product is used to bond heat sinks, LEDs and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips and automatic dispensing systems.

Thermal conductivity of 0.8 W/(m·K)
1:1 mix ratio
Working life: 4 minutes
Set time: 15 minutes
Cure time: 4 hours at room temperature or 15 minutes at 65 °C (149 °F)
Flame retardant standard
Provides strong electrical insulation
Low CTE prior Tg
High tensile and compressive strength
Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
Shelf life: ≥3 years

Specifications
Attribute Value
Type Thermal Conductive Adhesive
Product Material Epoxy
Package Type Syringe
Package Size 25 ml
Thermal Conductivity 0.8W/mK
Cure Time 4 (Room Temperature) h, 15 min @ +65 °C
Maximum Operating Temperature +150°C
Minimum Operating Temperature -40°C
Dielectric Strength 14.8kV/mm
Viscosity Measurement 72000 (Part A) cP/s, 110000 (Part B) cP/s
Setting Time 15min
Physical Form Liquid
Operating Temperature Range -40 → +150 °C
Specific Gravity 1.71
Viscosity Description Thixotropic
Temporarily out of stock - back order for despatch when stock is available
Unit of sale: Each
34.22
(exc. VAT)
42.09
(inc. VAT)
units
Per unit
1 - 14
€34.22
15 - 39
€32.90
40 +
€31.57
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