Thermal Interface Sheet, Hi-Flow 225F-AC, 1W/m·K, 11 x 12in 0.102mm, Self-Adhesive

  • RS Stock No. 127-041
  • Mfr. Part No. HF225FAC-0.004-AC-1112
  • Manufacturer Bergquist
Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): US
Product Details

Hi-Flow® 225 FAC

Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules

Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm

Specifications
Attribute Value
Dimensions 11 x 12in
Thickness 0.102mm
Length 11in
Width 12in
Thermal Conductivity 1W/m·K
Material Hi-Flow 225F-AC
Self-Adhesive Yes
Maximum Operating Temperature +120°C
Material Trade Name Hi-Flow 225F-AC
Operating Temperature Range Maximum of +120 °C
48 In stock for delivery within 2 working days
Unit of sale: Each
61.88
(exc. VAT)
76.11
(inc. VAT)
units
Per unit
1 - 49
€61.88
50 - 99
€55.09
100 - 249
€48.26
250 - 499
€45.03
500 +
€43.10
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