Ohmite M series high performance, configurable and compact heat sink with matrix clip system for TO-247 and TO-264 packages. This powerful heat sink provides easy assembly, large surface area and small footprint. It is the ideal type of heat sink for high power density and small size electronic packaging with forced convection cooling.
Attribute
Value
Length
27mm
Width
55.9mm
Height
43.5mm
Dimensions
27 x 55.9 x 43.5mm
Thermal Resistance
5.5°C/W
Mounting
Clip
Series
M
Material
Aluminium
Surface Area
24161mm²
Special Features
Flexible Design, Maximum Reliability Resilient Spring Action Locks Electronic Component in Place, Maximum Repeatability Constant Spring Force, Maximum Thermal Transfer