FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs
A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish
FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors
An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking
FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
C0G (NP0) is the most popular formulation of the "temperature-compensating", EIA Class I ceramic materials
X7R formulations are called "temperature stable" ceramics and fall into EIA Class II materials
Y5V formulations are for general-purpose use in a limited temperature range.These characteristics make Y5V ideal for decoupling applications
Attribute | Value |
---|---|
Capacitance | 1 nF |
Voltage | 100 V dc |
Package/Case | 1206 (3216M) |
Mounting Type | Surface Mount |
Dielectric | C0G, NP0 |
Tolerance | ±5% |
Dimensions | 3.2 x 1.6 x 1.6mm |
Length | 3.2mm |
Depth | 1.6mm |
Height | 1.6mm |
Series | Flexicap |
Maximum Operating Temperature | +125°C |
Minimum Operating Temperature | -55°C |
Terminal Type | Surface Mount |