MG Chemical Epoxy Thermal Adhesive, 2 h @ +65 °C, 24 (Room Temperature) h Cure, 25 ml Syringe

  • RS Stock No. 181-0365
  • Mfr. Part No. 8329TFM-25ML
  • Manufacturer MG Chemical
Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): CA
Product Details

8329TFM is a thermally conductive two-part epoxy adhesive. It is dark grey, smooth, thixotropic, and bonds well to a wide variety of substrates. This product is used to bond heat sinks, LEDs, and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips, and automatic dispensing systems.

Thermal conductivity of 1.1 W/(m·K)
1:1 mix ratio
Working life: 45 minutes
Cure time: 24 hours at room temperature or 2.5 hours at 65 °C (149 °F)
Provides strong electrical insulation
High tensile
Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
Shelf life: ≥3 years

Specifications
Attribute Value
Type Thermal Conductive Adhesive
Product Material Epoxy
Package Type Syringe
Package Size 25 ml
Thermal Conductivity 1.1W/mK
Cure Time 2 h @ +65 °C, 24 (Room Temperature) h
Maximum Operating Temperature +150°C
Minimum Operating Temperature -40°C
Viscosity Measurement 2000000cP/s
Viscosity Description Thixotropic
Dielectric Strength 7.3kV/mm
Physical Form Liquid
Operating Temperature Range -40 → +150 °C
Specific Gravity 2.23
Temporarily out of stock - back order for despatch when stock is available
Unit of sale: Each
34.22
(exc. VAT)
42.09
(inc. VAT)
units
Per unit
1 - 14
€34.22
15 - 39
€32.90
40 +
€31.57
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