silicone Thermal Grease, 2W/m·K

  • RS Stock No. 180-5314
  • Manufacturer RS PRO
Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
Product Details

RS PRO 18053142-Part Dispensible Thermal Gap Filler, 2.0W/mK Surface cure thermal interface paste specially designed to resist pumping out from the bond line. It can be applied using industrial dispensing equipment or via screen/stencil printing techniques.

Long term thermal stability,
recommended for applications with rapid temperature cycling,
easily dispensable,
fast curing time (when heated).
Automotive ECU (electronic control units), power supplies, microprocessors, displays and consumer electronics

Attribute Value
Thermal Conductivity 2W/m·K
Material Silicone
Maximum Operating Temperature +200°C
Minimum Operating Temperature -60°C
Operating Temperature Range -60 → +200 °C
Physical State Paste
7 In stock for delivery within 2 working days
Unit of sale: Each
(exc. VAT)
(inc. VAT)
Per unit
1 +