Vishay, 140V Zener Diode 5% 1.5 W Through Hole 2-Pin DO-204AL

  • RS Stock No. 813-3739P
  • Mfr. Part No. Z4KE140A-E3/54
  • Manufacturer Vishay
Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
Product Details

Zener Diodes 1.5W, Z4KE100A to Z4KE200A Series, Vishay Semiconductor

Glass Passivated Power Voltage-Regulating Diodes
Plastic MELF package
Ideal for automated placement
Low Zener impedance
Low regulation factor
AEC-Q101 qualified

Zener Diodes, Vishay Semiconductor

Specifications
Attribute Value
Nominal Zener Voltage 140V
Diode Configuration Single
Number of Elements per Chip 1
Mounting Type Through Hole
Maximum Power Dissipation 1.5 W
Package Type DO-204AL
Zener Type Voltage Regulator
Zener Voltage Tolerance 5%
Pin Count 2
Test Current 5mA
Maximum Zener Impedance 900Ω
Maximum Reverse Leakage Current 500nA
Length 5.2mm
Diameter 2.7mm
Dimensions 5.2 x 2.7mm
Minimum Operating Temperature -55 °C
Maximum Operating Temperature +150 °C
4940 In stock for delivery within 2 working days
Unit of sale: Each (Supplied on a Reel) Quantities below 150 on continuous strip
0.154
(exc. VAT)
0.189
(inc. VAT)
units
Per unit
20 +
€0.154
Packaging Options:
Related Products
GBU series bridge rectifiers in SIL PCB Mounting ...
Description:
GBU series bridge rectifiers in SIL PCB Mounting package from Vishay Semiconductor. Glass passivated junctionHigh surge current capabilityHigh case dielectric strength of 1500VrmsSoldering pins for Printed Circuit Board (PCB) through-hole mounting.
Features• Superectifier structure for high reliability condition• Cavity-free ...
Description:
Features• Superectifier structure for high reliability condition• Cavity-free glass-passivated junction• Fast switching for high efficiency• Low leakage current, typical IR less than 0.2 μA• High forward surge capability• Solder dip 275 °C max. 10 s, per JESD 22-B106Typical ...
FEATURES• Low profile package• Ideal for automated placement• ...
Description:
FEATURES• Low profile package• Ideal for automated placement• Glass passivated pellet chip junction• Ultrafast recovery times for high efficiency• Low forward voltage, low power losses• High forward surge capability• Meets MSL level 1, per J-STD-020, LF maximum peakof 260 ...
Features• Superectifier structure for high reliability application • ...
Description:
Features• Superectifier structure for high reliability application • Cavity-free glass-passivated junction • Low leakage current • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106• Single dieTypical Applications• High voltage power supplies• ...