Ideal for designs in the commercial vehicle market where mounting areas on a vehicle are exposed to harsh environments. Available in 3 sizes LE (large), ME (Mini) and SE (Small).
Features and Benefits
• Snap-fit design • Heatsink and vented options • Housings – Glass filled polymer • Pins – Brass – Post tin plated • Seals – Silicone elastomer
Available in this range: 581 01 30 043 SE with no heatsinks- 664-7220 581 01 60 033 LE with no heatsinks – 664-7236 581 01 60 039 LE with no heatsinks and membrane vent – 885-7071 581 01 30 059 SE with no heatsinks and membrane vent – 885-7078
PCB – Board Size (approximately) ME – 4.08 x 3.35" (103 x 85 mm) SE – 4.50 x 4.60" (114 x 117 mm) LE – 6.00 x 6.10" (152 x 155 mm)
Note
For Modice headers see typically stock no 664-7185 . For Spring Plates see stock no's 664-7242 and 664-7251
Cinch 581 01 30 043 enclosure
The 5810130043 is a small enclosure without heat sinks.
581 01 30 043 Features:
SE enclosure Easy assembly with snap-in design
Modular Integrated Connector Enclosure
Cinch's Modular Integrated Connector Enclosures offer high quality sealed packaging solutions for rugged electronic control module applications. The ModICE product line consists of two distinct enclosure sizes and 6 header configurations allowing 18, 30, 48 and 60 I/O mating to Cinch's SHS harness connectors.
Snap-in header simplifies module assembly Options include ferrite filtering and integrated heat sink Resistant to most fluids used in industrial applications Enclosure and Headers manufactured from glass filled polymer Sealing rated at IP65, IP66, IP67 and IP69K
