Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter, SOP to DIP
- RS Stock No.:
- 158-3001
- Mfr. Part No.:
- W9512RC
- Manufacturer:
- Winslow
Image representative of range
Bulk discount available
Subtotal (1 pack of 5 units)*
€106.62
(exc. VAT)
€131.145
(inc. VAT)
Stock information currently inaccessible - Please check back later
Units | Per unit | Per Pack* |
|---|---|---|
| 5 - 120 | €21.324 | €106.62 |
| 125 - 370 | €19.192 | €95.96 |
| 375 - 995 | €17.06 | €85.30 |
| 1000 - 1995 | €14.928 | €74.64 |
| 2000 + | €13.86 | €69.30 |
*price indicative
- RS Stock No.:
- 158-3001
- Mfr. Part No.:
- W9512RC
- Manufacturer:
- Winslow
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Product Type | IC Socket Adapter | |
| Connection A | SOP | |
| Number of Contacts A | 32 | |
| Connection Gender A | Female | |
| Connection Gender B | Male | |
| Number of Contacts B | 32 | |
| Connection B | DIP | |
| Contact Plating | Gold over Nickel | |
| Pitch | 2.54mm | |
| Mount Type | Through Hole | |
| Orientation | Straight | |
| Standards/Approvals | No | |
| Contact Material | Brass | |
| Housing Material | FR4 | |
| Select all | ||
|---|---|---|
Brand Winslow | ||
Product Type IC Socket Adapter | ||
Connection A SOP | ||
Number of Contacts A 32 | ||
Connection Gender A Female | ||
Connection Gender B Male | ||
Number of Contacts B 32 | ||
Connection B DIP | ||
Contact Plating Gold over Nickel | ||
Pitch 2.54mm | ||
Mount Type Through Hole | ||
Orientation Straight | ||
Standards/Approvals No | ||
Contact Material Brass | ||
Housing Material FR4 | ||
- COO (Country of Origin):
- GB
SOIC to DIP Sockets
Adaptics’ that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.
PCB: Epoxy Fibreglass FR4
IC Sockets-Package Adaptics DIP
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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