Samtec MEC8 Series Vertical Surface PCB Header, 60 Contact(s), 0.8 mm Pitch, 2 Row, Shrouded
- RS Stock No.:
- 637-684
- Mfr. Part No.:
- MEC8-130-02-L-DV-A-K
- Manufacturer:
- Samtec
Subtotal (1 tray of 52 units)*
€212.48
(exc. VAT)
€261.35
(inc. VAT)
Temporarily out of stock
- Shipping from 11 February 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Tray(s) | Per Tray | Per unit* |
|---|---|---|
| 1 + | €212.48 | €4.086 |
*price indicative
- RS Stock No.:
- 637-684
- Mfr. Part No.:
- MEC8-130-02-L-DV-A-K
- Manufacturer:
- Samtec
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Samtec | |
| Product Type | PCB Header | |
| Series | MEC8 | |
| Current | 2.3A | |
| Pitch | 0.8mm | |
| Housing Material | Black LCP, Liquid Crystal Polymer | |
| Number of Contacts | 60 | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface | |
| Contact Plating | Gold, Tin | |
| Contact Material | Beryllium Copper Alloy | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 0.8mm | |
| Termination Type | Vertical Surface Mount | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | PCI Express 4.0 | |
| Voltage | 255 V | |
| Select all | ||
|---|---|---|
Brand Samtec | ||
Product Type PCB Header | ||
Series MEC8 | ||
Current 2.3A | ||
Pitch 0.8mm | ||
Housing Material Black LCP, Liquid Crystal Polymer | ||
Number of Contacts 60 | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface | ||
Contact Plating Gold, Tin | ||
Contact Material Beryllium Copper Alloy | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 0.8mm | ||
Termination Type Vertical Surface Mount | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals PCI Express 4.0 | ||
Voltage 255 V | ||
The Samtec Pitch mini edge card connector designed for high-density board-to-board applications. It features a vertical, dual-row configuration and is optimized for .062" (1.57 mm) thick cards, offering reliable signal integrity in compact layouts.
Optional alignment pin
Current rating up to 2.3A per contact
Includes board guide and pick and place features
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