TE Connectivity AMPMODU MTE Series Right Angle Through Hole PCB Header, 4 Contact(s), 2.54mm Pitch, 1 Row(s), Shrouded

AMPMODU MTE right angle mount PCB headers for use with MTE IDC receptacle connectors to mass terminate wires in a wide variety of applications. These AMPMODU MTE headers are end to end stackable and feature an integral latching system which provides a secure mating connection with the IDC receptacle connector. Versions of these AMPMODU MTE PCB headers are available with hold-downs for a secure connection to the PCB

• Allow cost saving mass termination of wires when used with IDC connectors
• End to end stackable
• Integral latching mechanism for secure mating connection
• Versions available with hold-downs for secure PCB retention

These AMPMODU MTE PCB headers are suitable for mass terminating wires in a wide range of electronic equipment. Applications include computers, telecommunications, copiers, commercial printers, appliances, instrumentation and test equipment medical equipment and automotive controls

The AMPMODU 0.025 [0.64] square interconnection system is an industry standard providing level III and IV thru-hole interconnections. Surface mount vertical receptacle assemblies are available to meet your level II packaging needs as process technologies evolve from wave soldering to surface mount reflow (infrared and vapor-phase) processes. AMPMODU surface mount receptacle assemblies are offered in vertical dual entry configurations. These receptacles are available in single-row and double-row configurations with a contact centerline spacing of .100 x .100 [2.54 x 2.54]. AMPMODU surface mount vertical receptacle assemblies continue to provide the proven features and benefits of their thru-hole counterparts in the AMPMODU product family. Closed-entry style housing design provides a lead-in ramp for positive mating of contacts, virtually eliminating the possibility of stubbing. The dual-beam receptacle contact design, coupled with gold plating in the contact area, provides a reliable interface. Tin plating on the solder tails also enhances solderability. The incorporation of compliant metallic hold downs on receptacle assemblies offers multiple benefits. The hold downs provide for proper lead-to- pad registration and provide retention to the PC board prior to and during processing. Used with a plated thru-hole, the hold downs are soldered during the reflow process and serve as a strain relief for the solder joints during mating/unmating.

The TE Connectivity (TE) AMPMODU MTE interconnection system is utilized in wire-to-board and wire-to-wire applications, and can be found in many types of electronic equipment including computers, copiers, commercial printers, appliances, medical equipment, and automotive controls.

TE Connectivity AMPMODU MTE Interconnection System

AMPMODU MTE 2.54 mm pitch connector system for labour and cost saving mass termination of wires in wire-to-board and wire-to-wire applications. These MTE connectors are based on IDC (insulation displacement contact) technology allowing one-step assembly and eliminating the need for wire stripping saving both time and cost. Using production hand tooling these MTE IDC connectors can be quickly assembled to discrete wire. The AMPMODU MTE connector system consists of single row receptacle housings preloaded with IDC contacts and PCB headers. Coupling shrouds are also available which allow the ganging of connectors to form larger single row or double row connectors