BGA855N6E6327XTSA1 Infineon RF Amplifier Low Noise 17.8 dB, 6-Pin 1300MHz TSNP

RS Stock No.:: 258-0667
Mfr. Part No.:: BGA855N6E6327XTSA1
Manufacturer:: Infineon

BGA855N6E6327XTSA1 Infineon RF Amplifier Low Noise 17.8 dB, 6-Pin 1300MHz TSNP

Subtotal (1 reel of 12000 units)*

€2,964.00

(exc. VAT)

€3,648.00

(inc. VAT)

Temporarily out of stock

Shipping from 07 April 2027

Need more? Click ‘Check delivery dates’ to find extra stock and lead times.

Units	Per unit	Per Reel*
12000 +	€0.247	€2,964.00

*price indicative

RS Stock No.:: 258-0667
Mfr. Part No.:: BGA855N6E6327XTSA1
Manufacturer:: Infineon

Specifications

Technical data sheets

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	Infineon
	Operating Frequency	1300MHz
	Product Type	RF Amplifier
	Amplifier Type	Low Noise
	Technology	Silicon Germanium
	Gain	17.8dB
	Mount Type	Surface
	Minimum Supply Voltage	1.1V
	Package Type	TSNP
	Pin Count	6
	Maximum Supply Voltage	3.3V
	P1dB - Compression Point	60mW
	Minimum Operating Temperature	-40°C
	Third Order Intercept OIP3	0dBm
	Noise Figure	1.1dB
	Maximum Operating Temperature	85°C
	Standards/Approvals	JEDEC47/20/22
	Automotive Standard	No
	Series	BGA855N6

	Select all
	Brand Infineon
	Operating Frequency 1300MHz
	Product Type RF Amplifier
	Amplifier Type Low Noise
	Technology Silicon Germanium
	Gain 17.8dB
	Mount Type Surface
	Minimum Supply Voltage 1.1V
	Package Type TSNP
	Pin Count 6
	Maximum Supply Voltage 3.3V
	P1dB - Compression Point 60mW
	Minimum Operating Temperature -40°C
	Third Order Intercept OIP3 0dBm
	Noise Figure 1.1dB
	Maximum Operating Temperature 85°C
	Standards/Approvals JEDEC47/20/22
	Automotive Standard No
	Series BGA855N6

Datasheet - BGA855N6E6327XTSA1

Infineon BGA855N6 Series RF Amplifier, 0.60dB Noise Figure, 17.8dB Gain - BGA855N6E6327XTSA1

This RF amplifier is a silicon-germanium low-noise amplifier designed for single-frequency RF stages operating at 1300MHz. It is a surface-mount device supplied in a TSNP package and intended for systems requiring low-voltage operation and Compact board integration. The device functions across a wide temperature range and conforms to JEDEC47 mechanical standards for reliability in assembly and handling.

Features and Benefits:

• 0.60dB noise figure for improved weak-signal reception
• 17.8dB gain to increase signal amplitude with low distortion
• 1.1 to 3.3V supply range for low-voltage system compatibility
• P1dB 60 mW output compression point to maintain linearity under drive
• OIP3 0 dBm for third-order intermodulation characterisation

Applications

• Suitable for single-frequency receiver front-ends
• Ideal for short-range RF communication modules
• Used with Compact surface-mount transceiver assemblies
• Can be used for low-power wireless test platforms
• Suitable for laboratory evaluation of SiGe amplifier stages

What supply voltages are required for operation?

It operates from a minimum of 1.1V up to a maximum of 3.3V.

What thermal conditions can it tolerate during use?

The device is rated from -40 to 85°C for operating environments.

What package and mounting method does it use?

It is supplied in a TSNP package intended for surface mounting.

How many electrical connections does the device provide?

The component has a pin count of 6 for PCB interfacing.