Vishay SISS32LDN Type N-Channel Single MOSFETs, 63 A, 80 V Enhancement, 8-Pin PowerPAK

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RS Stock No.:
653-104
Mfr. Part No.:
SISS32LDN-T1-BE3
Manufacturer:
Vishay
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Brand

Vishay

Channel Type

Type N

Product Type

Single MOSFETs

Maximum Continuous Drain Current Id

63A

Maximum Drain Source Voltage Vds

80V

Series

SISS32LDN

Package Type

PowerPAK

Mount Type

Surface

Pin Count

8

Maximum Drain Source Resistance Rds

0.0072Ω

Channel Mode

Enhancement

Maximum Power Dissipation Pd

65.7W

Forward Voltage Vf

1.1V

Maximum Gate Source Voltage Vgs

20V

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

17.7nC

Maximum Operating Temperature

150°C

Width

3.3mm

Length

3.3mm

Height

0.75mm

Standards/Approvals

RoHS

Automotive Standard

No

COO (Country of Origin):
TH

Vishay SISS32LDN Series Single MOSFETs, 80V Maximum Drain Source Voltage, 63A Maximum Continuous Drain Current - SISS32LDN-T1-BE3


This single MOSFET is a compact N-channel enhancement device designed for high-current switching in surface-mount applications. It operates across a wide temperature range and is intended for use where efficient conduction and robust voltage handling are required. The device is suitable for power conversion and switching stages in electronic systems that demand low conduction losses and moderate switching energy.

Features and Benefits:


• Very low Rds(on) 0.0072Ω reduces conduction losses under load
• 80V drain-source rating supports high-voltage switching tasks
• Continuous drain current 63A enables substantial load handling
• Maximum power dissipation 65.7W allows sustained thermal performance
• Gate charge 17.7nC facilitates predictable switching behaviour
• Forward voltage 1.1V minimises drop during conduction

Applications


• Suitable for 80V DC-DC converter switching stages
• Ideal for high-current synchronous rectification designs
• Used with power trains in industrial motor controllers
• Can be used for load switching in server power supplies
• Suitable for compact SMD power modules and assemblies

What mounting style does it require for assembly?


It is supplied in a PowerPAK surface-mount package intended for reflow soldering onto PCB land patterns.

How does it perform thermally at elevated temperatures?


The device is specified to operate up to 150°C junction temperature, enabling use in thermally demanding environments when appropriate thermal management is applied.

What gate voltage limits should be observed during drive?


The maximum gate-to-source voltage is 20V, so gate-drive circuitry should remain within this limit to avoid device stress.

Is it suitable for automotive-qualified designs?


It is not classified as an automotive-standard device

designers should assess qualification needs against system requirements.

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