Molex Micro-Fit 3.0 Series Vertical Through Hole PCB Header, 4 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded

Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx12, xx13 and xx14 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

• High current carrying capacity in a small footprint
• High temperature housings for IR reflow soldering
• Through hole versions SMT compatible
• Positive latching for secure mating connection
• Fully isolated dual beam terminals for reliable electrical performance and contact
• PCB polarising pegs for alignment and positioning on PCB

These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals

This PCB header offers connectivity solutions suitable for various applications, serving as a crucial component in electronic circuits. Its compatibility with surface mount technology and efficient through hole mounting ensures its effectiveness in automation and electrical projects.

• Vertical orientation for efficient space utilisation
• Glow-wire compliant for safety in high-temperature applications
• Supports up to 30 mating cycles

• Utilised with 4 circuits in automated equipment
• Commonly integrated in industrial machinery
• Suitable for powering wire-to-board configurations

Yes, it operates effectively in temperatures ranging from -40°C to +105°C, making it suitable for challenging environments.

A PCB thickness of 1.60mm is recommended to ensure proper seating and connection stability.

Yes, it supports lead-free solder processes and is wave capable for through hole applications.

It is rated for a maximum of 30 mating cycles, ensuring consistent performance over time.

Molex Micro-Fit 3.0 Series