Amphenol ICC 1 mm Pitch 240 Way, Vertical Through Hole Mount DDR3 DIMM Socket ,1.5V
- RS Stock No.:
- 787-612
- Mfr. Part No.:
- 10081530-11107LF
- Manufacturer:
- Amphenol ICC
Subtotal (1 tray of 100 units)*
€209.46
(exc. VAT)
€257.64
(inc. VAT)
New product - Preorder today
- Shipping from 22 July 2026
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Tray(s) | Per Tray | Per unit* |
|---|---|---|
| 1 + | €209.46 | €2.095 |
*price indicative
- RS Stock No.:
- 787-612
- Mfr. Part No.:
- 10081530-11107LF
- Manufacturer:
- Amphenol ICC
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Amphenol ICC | |
| Product Type | DIMM Socket | |
| Memory Socket Type | DDR3 | |
| Orientation | Vertical | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Number of Contacts | 240 | |
| Pitch | 1mm | |
| Mount Type | Through Hole | |
| Housing Material | High Temperature Thermoplastic | |
| SDRAM Type | DDR3 | |
| Termination Type | Through Hole | |
| Latching | Yes | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 85°C | |
| Row Spacing | 3mm | |
| Standards/Approvals | JEDEC MO-269 | |
| Voltage | 1.5V | |
| Series | 10081530 | |
| Select all | ||
|---|---|---|
Brand Amphenol ICC | ||
Product Type DIMM Socket | ||
Memory Socket Type DDR3 | ||
Orientation Vertical | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Number of Contacts 240 | ||
Pitch 1mm | ||
Mount Type Through Hole | ||
Housing Material High Temperature Thermoplastic | ||
SDRAM Type DDR3 | ||
Termination Type Through Hole | ||
Latching Yes | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 85°C | ||
Row Spacing 3mm | ||
Standards/Approvals JEDEC MO-269 | ||
Voltage 1.5V | ||
Series 10081530 | ||
- COO (Country of Origin):
- CN
The Amphenol Connector offers robust and reliable connectivity solutions for diverse applications, ensuring optimal performance and durability under various conditions.
Designed for high performance and reliability in various environments
Ensures robust connectivity for enhanced signal integrity
Construction optimised for durability and long service life
Supports a wide range of applications with versatile compatibility
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