Infineon IMB Type N-Channel MOSFET, 8.1 A, 1200 V Enhancement, 7-Pin PG-TO263-7 IMBG120R234M2HXTMA1

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€9.41

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€11.574

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2 - 18€4.705€9.41
20 - 198€4.24€8.48
200 - 998€3.905€7.81
1000 - 1998€3.625€7.25
2000 +€3.24€6.48

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RS Stock No.:
349-107
Mfr. Part No.:
IMBG120R234M2HXTMA1
Manufacturer:
Infineon
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Brand

Infineon

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

8.1A

Maximum Drain Source Voltage Vds

1200V

Package Type

PG-TO263-7

Series

IMB

Mount Type

Surface

Pin Count

7

Maximum Drain Source Resistance Rds

622mΩ

Channel Mode

Enhancement

Maximum Power Dissipation Pd

80W

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

7.9nC

Maximum Operating Temperature

200°C

Length

15mm

Height

4.5mm

Standards/Approvals

JEDEC47/20/22, RoHS

Automotive Standard

No

COO (Country of Origin):
MY

Infineon IMB Series MOSFET, 1200V Maximum Drain Source Voltage, 80W Maximum Power Dissipation - IMBG120R234M2HXTMA1


This MOSFET is a high-voltage N-channel switching device designed for surface-mount power applications. It delivers controlled conduction for switching and conversion functions while operating across a wide ambient range. The component is configured in a seven-pin PG-TO263-7 package for integration onto power boards and is suitable where robust gate drive and high blocking voltage are required.

Features and Benefits:


• 1200V drain rating enables high-voltage switching applications
• 8.1A continuous drain current supports moderate power throughput
• 80W power dissipation allows sustained thermal loading
• 622mΩ low Rds(on) reduces conduction losses during operation
• 7.9nC gate charge enables relatively fast switching transitions
• 25V gate tolerance ensures compatibility with common gate drives

Applications


• Used for high-voltage DC-DC converters in industrial systems
• Suitable for power switching in renewable-energy inverters
• Ideal for motor-drive front-ends with elevated voltage rails
• Can be used for switch-mode power supplies and regulators
• Used with thermal management for compact power modules

What thermal extremes can this device withstand during operation?


It is rated to function between -55°C and 200°C, allowing use in environments with very low temperatures and exceptionally high junction or ambient conditions when suitably mounted and cooled.

How does the pin configuration affect PCB design and mounting?


The seven-pin PG-TO263-7 layout concentrates power and gate connections for effective heat transfer to the board and simplifies routing of drain and source tracks for low‑impedance current paths.

What standards and environmental constraints are reflected in its manufacture?


Production conforms to JEDEC47/20/22 handling recommendations and the device meets RoHS requirements for restricted substances.

How should designers account for switching performance in high-frequency circuits?


Use the typical 7.9nC gate charge figure to estimate gate-drive energy and select gate drivers and deadtime settings to balance switching losses and electromagnetic emission control.

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