TE Connectivity AMPMODU Series Vertical Board PCB Header, 12 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

View all PCB Headers

Subtotal (1 tray of 80 units)*

€263.54

(exc. VAT)

€324.15

(inc. VAT)

Add to Basket
Select or type quantity
Temporarily out of stock
  • Shipping from 21 January 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Tray(s)
Per Tray
Per unit*
1 +€263.54€3.294

*price indicative

RS Stock No.:
472-069
Mfr. Part No.:
5-103168-4
Manufacturer:
TE Connectivity
Find similar products by selecting one or more attributes.
Select all

Brand

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Current

3A

Pitch

2.54mm

Number of Contacts

12

Housing Material

Thermoplastic

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Plating

Tin

Contact Material

Phosphor Bronze

Row Pitch

2.54mm

Termination Type

Solder

Minimum Operating Temperature

-65°C

Maximum Operating Temperature

105°C

Standards/Approvals

CSA, RoHS, UL

Distrelec Product Id

304-50-803

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Header is engineered for versatile connectivity solutions, ensuring seamless board-to-board connections with its fully shrouded design. This robust header accommodates 12 positions on a 2.54 mm centreline, making it an ideal choice for compact applications requiring high reliability. With a vertical orientation and solder-through hole termination, it is designed to integrate effortlessly into a wide range of electronic assemblies. Crafted from high-quality thermoplastic and featuring nickel underplating, this component supports exceptional electrical performance while maintaining durability across diverse environments. Its compatibility with industry standards guarantees optimal functionality, while the exceptional insulation resistance and dielectric withstanding voltage specifications make it ideal for signal circuit applications, delivering unparalleled performance.

Fully shrouded design for enhanced protection against environmental factors

Vertical orientation optimises space utilisation in compact designs

High insulation resistance ensures reliable performance over time

Nickel contact underplating supports superior conductivity

Thermoplastic housing material offers excellent durability

Designed for board-to-board applications, facilitating easy connections

Polarisation allows for secure and accurate mating

Wave solder capable, enhancing assembly efficiency

Related links