TE Connectivity Fortis Zd Series Right Angle Panel PCB Header, 90 Contact(s), 0.08 mm Pitch, 9 Row, Shrouded

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Subtotal (1 pack of 2 units)*

€234.47

(exc. VAT)

€288.40

(inc. VAT)

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Per unit*
1 +€234.47€117.235

*price indicative

RS Stock No.:
501-762
Mfr. Part No.:
2102318-1
Manufacturer:
TE Connectivity
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Brand

TE Connectivity

Series

Fortis Zd

Product Type

PCB Header

Current

1.5A

Pitch

0.08mm

Number of Contacts

90

Number of Rows

9

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Panel

Minimum Operating Temperature

65°C

Row Pitch

0.08mm

Maximum Operating Temperature

125°C

Standards/Approvals

No

Distrelec Product Id

304-49-629

Non Compliant

COO (Country of Origin):
US
The TE Connectivity 90 Position High Speed Backplane Connector is engineered for high-performance applications, seamlessly facilitating robust electrical connections within PCB layouts. It boasts a right-angle design that not only optimises space utilisation but also simplifies assembly processes. Designed specifically for traditional backplane architecture, this connector provides unparalleled reliability and efficiency for signal transmission. With a partially shrouded header and a precise .08 mm centreline, it ensures secure mating and alignment, making it an ideal choice for modern electronic systems where space and performance are critical. Its wide operating temperature range from -65°C to 125°C guarantees dependable functionality even in challenging environments, solidifying its standing as a top-tier connector solution for demanding applications.

Compact right-angle configuration enhances design versatility

Partially shrouded design allows for secure connections

Compatible with various PCB layouts for enhanced design flexibility

Durable construction supports long-term use in rigorous environments

Optimised for traditional backplane architecture, ensuring high efficiency

Rated for maximum current up to 1.5 A for reliable performance

Easy installation process reduces assembly time and effort

Adaptable for multiple applications in electronic systems

Low row-to-row spacing maximises available board space

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