TE Connectivity 2.54 mm Pitch 28 Way DIP Through Hole DIP IC Socket

The TE Connectivity Sophisticated dual in-line package (DIP) socket designed for seamless integration into electronic circuits. This product stands out with its robust construction, featuring high-quality materials that ensure longevity and reliable performance in demanding applications. Engineered for versatility, it is suitable for a range of PCB layouts, facilitating both assembly and maintenance. The socket's design incorporates features that promote efficient signal transmission, making it an ideal choice for various electronic projects and products needing dependable interconnect solutions. Its compact profile aids in effective space utilization on the PCB, while its vertical orientation optimises connection integrity, ensuring optimal functionality. Whether for prototyping or final products, this DIP socket exemplifies precision and efficiency in modern electronic design.

Designed for effective signal transfer in diverse electronic applications