TE Connectivity 0.5 mm Pitch 260 Way, Right Angle Board Mount DIMM Socket ,1.2 V, 500mA

Subtotal (1 reel of 450 units)*

€632.71

(exc. VAT)

€778.23

(inc. VAT)

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Reel(s)
Per Reel
Per unit*
1 +€632.71€1.406

*price indicative

RS Stock No.:
481-903
Distrelec Article No.:
304-59-550
Mfr. Part No.:
2309407-3
Manufacturer:
TE Connectivity
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Brand

TE Connectivity

Product Type

DIMM Socket

Memory Socket Type

DIMM

Orientation

Right Angle

Insertion/Removal Method

Cam-In

Current

500mA

Contact Material

Copper Alloy

Contact Plating

Gold

Number of Contacts

260

Pitch

0.5mm

Mount Type

Board

Housing Material

High Temperature Thermoplastic

Latching

Yes

Minimum Operating Temperature

-55°C

Termination Type

Surface Mount

Row Spacing

8.2mm

Maximum Operating Temperature

85°C

Standards/Approvals

UL 94V-0, 2016, EU ELV Directive 2000/53/EC, EU RoHS Directive 2011/65/EU, China RoHS 2 Directive MIIT Order No 32, EU REACH Regulation (EC) No. 1907/2006

Series

DDR4 DIMM

Voltage

1.2 V

COO (Country of Origin):
CN
The TE Connectivity Small Outline (SO) DDR4 DIMM Socket is designed for precision and reliability in modern electronic applications. Featuring a stack height of just 4 mm, this right angle module orientation facilitates seamless integration into compact configurations. With 260 positions and a 0.5 mm centerline, it supports high-speed data transfer, ideal for performance-driven environments. Designed for surface mounting, this socket guarantees durability with a robust construction of high-temperature thermoplastic, ensuring long-lasting operation in various conditions. Its advanced engineering accommodates an operating temperature range from -55 to 85 °C, making it suitable for both consumer and industrial applications. Elevate your designs with a product that embodies innovative connector technology and outstanding compliance with industry standards.

Ensures efficient space utilization due to its compact design

Facilitates easy installation with a user-friendly mounting type

Utilizes gold flash plating for enhanced conductivity and reliability

Offers dual ejector location to support flexibly mounted modules

Incorporates a standard keying alignment for precise fits

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