Molex 503304 Series Vertical Surface PCB Header, 12 Contact(s), 0.4 mm Pitch, 2 Row, Unshrouded

Subtotal (1 reel of 3000 units)*

€2,021.81

(exc. VAT)

€2,486.83

(inc. VAT)

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  • Ready to ship from 01 July 2026
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Reel(s)
Per Reel
Per unit*
1 +€2,021.81€0.674

*price indicative

RS Stock No.:
478-189
Distrelec Article No.:
304-62-340
Mfr. Part No.:
503304-1240
Manufacturer:
Molex
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Brand

Molex

Product Type

PCB Header

Series

503304

Pitch

0.4mm

Number of Contacts

12

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Surface

Row Pitch

0.4mm

Standards/Approvals

CHINA RoHS, EU RoHS Compliant, IEC-62474, IPC 1752A Class C, IPC 1752A Class D

COO (Country of Origin):
JP
The Molex connector offers exceptional performance in board-to-board connectivity, specifically crafted for applications requiring Compact design without compromising on quality or reliability. Designed with a 0.40mm pitch, it facilitates seamless integration while ensuring optimal signal transmission at a stacking height of just 0.70mm. The dual-row configuration provides enhanced density in tight spaces, making it an Ideal choice for sophisticated electronic assemblies. With a robust engineering focus, this connector stands out for its compatibility and ease of integration, ensuring that it meets the demanding requirements of modern applications. The product boasts low-halogen materials, catering to strict environmental compliance standards, and reinforces the commitment to sustainability in the electronics industry.

Designed for precision with a 0.40mm pitch configuration

Dual-row setup enables high-density board arrangements

Low-halogen construction aligns with contemporary safety standards

Facilitates smooth integration for various signal applications

Ensures reliable connections with minimal interference

Engineered for durability, supporting long-term performance

Compatible with moulded components for versatile usage

Enhances sustainability through a compliant environmental profile

Streamlined design reduces footprint without sacrificing performance

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