TE Connectivity IMPACT Series Vertical Board PCB Header, 72 Contact(s), 1.9 mm Pitch, 9 Row, Shrouded

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Subtotal (1 tube of 33 units)*

€291.64

(exc. VAT)

€358.72

(inc. VAT)

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Tube(s)
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Per unit*
1 +€291.64€8.838

*price indicative

RS Stock No.:
504-936
Mfr. Part No.:
2057764-3
Manufacturer:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

IMPACT

Pitch

1.9mm

Current

0.75A

Number of Contacts

72

Housing Material

Liquid Crystal Polymer

Number of Rows

9

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Plating

Gold

Contact Material

Copper Alloy

Minimum Operating Temperature

-55°C

Row Pitch

1.9mm

Termination Type

Solder

Maximum Operating Temperature

85°C

Tail Pin Length

1.2mm

Mating Pin Length

5.5mm

Standards/Approvals

No

Voltage

30 V

Distrelec Product Id

304-49-609

COO (Country of Origin):
CN
The TE Connectivity 72 Position High Speed Backplane Connector is a remarkable component designed for demanding signal applications. Engineered with precision, this connector features a vertical, partially shrouded PCB mount header, ensuring robust connectivity with minimal signal loss. Its staggered pin design is tailored for high-density setups, providing exceptional performance in tight spaces. The durable construction and utilisation of LCP (Liquid Crystal Polymer) material allow for a reliable operation within a wide temperature range, making it suitable for various industrial applications. With a data rate of 25 Gb/s and a configuration of 9 rows and 8 columns, it is ideal for sophisticated backplane systems, ensuring efficient signal transmission while maintaining electrical integrity.

Offers a durable design for long-lasting performance

Designed for easy integration into complex circuit applications

Supports multiple differential pairs to enhance signal integrity

Facilitates vertical PCB mounting, optimising space in enclosures

Utilises a partial shroud style for effective signal management

Incorporates advanced mating alignment features for simplified connectivity

Constructed with materials that are compliant with environmental standards

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