Molex 1 mm Pitch 240 Way, Vertical Through Hole Mount DDR3 Socket ,30V, 1A

RS Stock No.:: 691-841
Mfr. Part No.:: 78315-0001
Manufacturer:: Molex

Molex 1 mm Pitch 240 Way, Vertical Through Hole Mount DDR3 Socket ,30V, 1A

Image representative of range

Subtotal (1 tray of 20 units)*

€250.64

(exc. VAT)

€308.29

(inc. VAT)

Stocked by manufacturer

Ready to ship from 08 June 2026

Need more? Click ‘Check delivery dates’ to find extra stock and lead times.

Tray(s)	Per Tray	Per unit*
1 +	€250.64	€12.532

*price indicative

RS Stock No.:: 691-841
Mfr. Part No.:: 78315-0001
Manufacturer:: Molex

Specifications

Technical data sheets

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	Molex
	Product Type	Socket
	Memory Socket Type	DIMM
	Orientation	Vertical
	Contact Material	Copper Alloy
	Current	1A
	Contact Plating	Gold
	Number of Contacts	240
	Pitch	1mm
	Mount Type	Through Hole
	Housing Material	Nylon
	SDRAM Type	DDR3
	Latching	Yes
	Termination Type	Pin
	Minimum Operating Temperature	-55°C
	Maximum Operating Temperature	85°C
	Standards/Approvals	RoHS Compliant
	Series	78315
	Voltage	30V

	Select all
	Brand Molex
	Product Type Socket
	Memory Socket Type DIMM
	Orientation Vertical
	Contact Material Copper Alloy
	Current 1A
	Contact Plating Gold
	Number of Contacts 240
	Pitch 1mm
	Mount Type Through Hole
	Housing Material Nylon
	SDRAM Type DDR3
	Latching Yes
	Termination Type Pin
	Minimum Operating Temperature -55°C
	Maximum Operating Temperature 85°C
	Standards/Approvals RoHS Compliant
	Series 78315
	Voltage 30V

Datasheet - 78315-0001

COO (Country of Origin):: ID

The Molex DDR3 DIMM Socket is designed for optimal performance in memory module connectivity. This low-profile, vertical socket features a 1.00mm pitch and is engineered for press-fit applications, ensuring a secure connection with its black housing and latches. It supports 240 circuits and is compliant with demanding standards, making it Ideal for use in various electronic devices. With a gold-plated contact Interface and a Durable copper alloy metal construction, it offers reliable functionality in environments ranging from -55°C to +85°C. This socket combines high performance with user-friendly design, facilitating seamless integration in your next project.

Designed for memory module connectors with a secure vertical entry angle

Equipped with a Durable black housing and latches for reliable connectivity

Built to withstand up to 25 mating cycles for enhanced longevity and performance

Compatible with standard JEDEC 1.27mm modules, streamlining integration

Recommended PCB thickness of 2.40mm for optimal fit and stability

Includes PCB locator and retention features for improved assembly reliability

Molex 1 mm Pitch 240 Way, Vertical Through Hole Mount DDR3 Socket ,30V, 1A

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