Molex 1 mm Pitch 240 Way, Vertical Through Hole Mount DDR3 Socket ,30V, 1A

RS Stock No.:: 693-845
Mfr. Part No.:: 78315-0011
Manufacturer:: Molex

Molex 1 mm Pitch 240 Way, Vertical Through Hole Mount DDR3 Socket ,30V, 1A

Image representative of range

Subtotal (1 tray of 20 units)*

€231.84

(exc. VAT)

€285.16

(inc. VAT)

Stocked by manufacturer

Ready to ship from 08 June 2026

Need more? Click ‘Check delivery dates’ to find extra stock and lead times.

Tray(s)	Per Tray	Per unit*
1 +	€231.84	€11.592

*price indicative

RS Stock No.:: 693-845
Mfr. Part No.:: 78315-0011
Manufacturer:: Molex

Specifications

Technical data sheets

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	Molex
	Memory Socket Type	DIMM
	Product Type	Socket
	Insertion/Removal Method	Latched
	Orientation	Vertical
	Contact Material	Copper Alloy
	Current	1A
	Contact Plating	Gold
	Number of Contacts	240
	Pitch	1mm
	Mount Type	Through Hole
	Housing Material	Nylon
	SDRAM Type	DDR3
	Minimum Operating Temperature	-55°C
	Termination Type	Press Fit
	Latching	Yes
	Maximum Operating Temperature	85°C
	Standards/Approvals	UL E29179
	Voltage	30V
	Series	78315

	Select all
	Brand Molex
	Memory Socket Type DIMM
	Product Type Socket
	Insertion/Removal Method Latched
	Orientation Vertical
	Contact Material Copper Alloy
	Current 1A
	Contact Plating Gold
	Number of Contacts 240
	Pitch 1mm
	Mount Type Through Hole
	Housing Material Nylon
	SDRAM Type DDR3
	Minimum Operating Temperature -55°C
	Termination Type Press Fit
	Latching Yes
	Maximum Operating Temperature 85°C
	Standards/Approvals UL E29179
	Voltage 30V
	Series 78315

Datasheet - 78315-0011

COO (Country of Origin):: ID

The Molex DDR3 DIMM Socket is designed to provide superior connectivity for memory modules while ensuring optimal durability. Featuring a very low-profile and aerodynamic design, this socket is Ideal for applications requiring efficient space utilisation. The component boasts a vertical entry angle and is meticulously engineered for press-fit assembly, making installation straightforward. With a tin-plated termination and 0.76μm gold plating on the mating surface, this part ensures excellent electrical performance and long-term reliability. Capable of accommodating up to 240 circuits, it is perfect for Advanced memory solutions, including compliance with various industry standards, and is suited for use in lead-free environments.

Obsolete status ensures clarity for legacy compatibility

High durability with a maximum of 25 mating cycles, optimising lifespan

Supports vertical entry for streamlined integration in Compact designs

Compliance with key directives such as EU RoHS and REACH SVHC

Accommodates a PCB thickness of 2.60mm, strict adherence to design specifications

Works seamlessly with standard 1.27mm JEDEC modules which ensuring versatility

Molex 1 mm Pitch 240 Way, Vertical Through Hole Mount DDR3 Socket ,30V, 1A

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