Molex 0.85 mm Pitch 288 Way, Vertical Through Hole Mount DDR4 Socket ,29V, 0.75A
- RS Stock No.:
- 693-666
- Mfr. Part No.:
- 78726-1012
- Manufacturer:
- Molex
Subtotal (1 tray of 60 units)*
€229.33
(exc. VAT)
€282.08
(inc. VAT)
Stocked by manufacturer
- Ready to ship from 08 June 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Tray(s) | Per Tray | Per unit* |
|---|---|---|
| 1 + | €229.33 | €3.822 |
*price indicative
- RS Stock No.:
- 693-666
- Mfr. Part No.:
- 78726-1012
- Manufacturer:
- Molex
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Memory Socket Type | DIMM | |
| Product Type | Socket | |
| Orientation | Vertical | |
| Insertion/Removal Method | Latched | |
| Contact Material | Copper Alloy | |
| Current | 0.75A | |
| Contact Plating | Gold over Tin | |
| Number of Contacts | 288 | |
| Pitch | 0.85mm | |
| Mount Type | Through Hole | |
| Housing Material | Nylon | |
| SDRAM Type | DDR4 | |
| Minimum Operating Temperature | -55°C | |
| Latching | Yes | |
| Termination Type | Through Hole | |
| Row Spacing | 1.58mm | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | CSA LR19980 | |
| Voltage | 29V | |
| Series | 78726 | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Memory Socket Type DIMM | ||
Product Type Socket | ||
Orientation Vertical | ||
Insertion/Removal Method Latched | ||
Contact Material Copper Alloy | ||
Current 0.75A | ||
Contact Plating Gold over Tin | ||
Number of Contacts 288 | ||
Pitch 0.85mm | ||
Mount Type Through Hole | ||
Housing Material Nylon | ||
SDRAM Type DDR4 | ||
Minimum Operating Temperature -55°C | ||
Latching Yes | ||
Termination Type Through Hole | ||
Row Spacing 1.58mm | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals CSA LR19980 | ||
Voltage 29V | ||
Series 78726 | ||
- COO (Country of Origin):
- CN
The Molex DDR4 DIMM Socket is engineered for vertical through-hole applications, specifically designed to meet the rigorous demands of modern memory module connectivity. This component features a robust construction with 288 circuits, ensuring seamless integration and reliable performance in high-density PCB environments. The precision gold plating provides exceptional conductivity and durability, while the low-halogen materials contribute to environmentally conscious designs. With a recommended PCB thickness of 1.57mm, this socket supports optimal electrical and thermal management, making it Ideal for diverse applications in the realm of memory modules.
288 circuits for high density memory module support
Vertical through-hole design ensures optimal mounting stability
Gold plating for superior electrical conductivity and longevity
Low-halogen materials comply with environmental safety standards
Black housing and latch provide secure and discreet integration
Durable construction rated for up to 25 mating cycles
Compatible with JEDEC MO-309 outline for standardised fit
Designed to operate effectively within a temperature range of -55° to +85°C.
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