Microchip ARM Cortex Microcontroller, 1 GHz, 343-Pin TFBGA
- RS Stock No.:
- 249-2490
- Mfr. Part No.:
- SAMA7G54-V/4HB
- Manufacturer:
- Microchip
Bulk discount available
Subtotal (1 tray of 119 units)*
€1,370.166
(exc. VAT)
€1,685.278
(inc. VAT)
In Stock
- 238 unit(s) ready to ship from another location
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Tray* |
|---|---|---|
| 119 - 119 | €11.514 | €1,370.17 |
| 238 + | €11.226 | €1,335.89 |
*price indicative
- RS Stock No.:
- 249-2490
- Mfr. Part No.:
- SAMA7G54-V/4HB
- Manufacturer:
- Microchip
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Microchip | |
| Product Type | Microcontroller | |
| Package Type | TFBGA | |
| Mount Type | Surface | |
| Pin Count | 343 | |
| Device Core | ARM Cortex | |
| Interface Type | SDIO, QSPI | |
| Maximum Clock Frequency | 1GHz | |
| RAM Size | 128kB | |
| Maximum Supply Voltage | 1.21V | |
| Number of Programmable I/Os | 136 | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | RoHS Compliant | |
| Minimum Supply Voltage | 1.12V | |
| ADCs | 12 bit | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Microchip | ||
Product Type Microcontroller | ||
Package Type TFBGA | ||
Mount Type Surface | ||
Pin Count 343 | ||
Device Core ARM Cortex | ||
Interface Type SDIO, QSPI | ||
Maximum Clock Frequency 1GHz | ||
RAM Size 128kB | ||
Maximum Supply Voltage 1.21V | ||
Number of Programmable I/Os 136 | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals RoHS Compliant | ||
Minimum Supply Voltage 1.12V | ||
ADCs 12 bit | ||
Automotive Standard No | ||
This Microchip high-performance, Arm Cortex-A7 CPU-based embedded microprocessor (MPU) running up to 1 GHz. It supports multiple memories such as 16-bit DDR2, DDR3, DDR3L, LPDDR2, LPDDR3 with flexible boot options from octal/quad SPI, SD/eMMC as well as 8-bit SLC/MLC NAND Flash.
Optimized BGA ball-out facilitates 4-layer PCB designs
Optimized Power Management IC and Integrated LDOs
Well-suited for IoT security requirements
Large number of connectivity options
Related links
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