Infineon Low Side 1, Low Side Power Switch IC 3-Pin, TO-263

Subtotal (1 reel of 1000 units)*

€3,984.00

(exc. VAT)

€4,900.00

(inc. VAT)

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1000 +€3.984€3,984.00

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RS Stock No.:
229-1757
Mfr. Part No.:
BTS3018TCATMA1
Manufacturer:
Infineon
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Brand

Infineon

Power Switch Type

Low Side

Product Type

Power Switch IC

Power Switch Topology

Low Side

Switch On Resistance RdsOn

44mΩ

Number of Outputs

2

Number of Inputs

1

Mount Type

Surface

Package Type

TO-263

Minimum Supply Voltage

2V

Maximum Supply Voltage

60V

Pin Count

3

Operating Current

6A

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

150°C

Width

15mm

Standards/Approvals

No

Length

10mm

Height

4.4mm

Automotive Standard

AEC

Series

HITFET

Infineon HITFET Series Power Switch IC, 60V Maximum Supply Voltage, 6A Operating Current - BTS3018TCATMA1


This power switch IC is a low-side semiconductor designed for automotive applications meeting AEC expectations and intended for surface-mount deployment. It controls power flow in vehicle circuits across a broad supply range and supports dual-output switching with a single input, operating in demanding thermal conditions while handling moderate currents.

Features and Benefits:


• Low-side configuration enables controlled grounding of loads
• Handles up to 6 A operating current for moderate load demands
• Operates from 2 V to 60 V to accommodate varied vehicle rails
• Low RDS(on) of 44 mΩ reduces conduction losses
• Rated for −40 °C to 150 °C to tolerate extreme temperatures
• Surface-mount TO-263 package simplifies automated assembly

Applications


• Suitable for switching automotive lighting and signalling loads
• Ideal for controlling small motors and actuators in vehicles
• Used with multiplexed body control modules for dual outputs
• Can be used for protection and load-disconnect functions
• Suitable for junction-box and power-distribution modules

How many external control lines are required to operate it?


It uses one input to govern two separate outputs.

What pin count should designers allocate on the PCB footprint?


The component requires a 3-pin footprint for electrical connections.

What mounting style is needed during assembly?


It requires surface-mounted placement compatible with TO-263 soldering.

What physical envelope should be allowed for thermal management?


Allow for a component measuring 15 mm by 10 mm with 4.4 mm height in the layout.

What topology does it implement for load switching?


It implements a low-side switching topology for grounding loads.

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