TE Connectivity 2.54 mm Pitch 32 Way Surface DIP IC Socket

Subtotal (1 pack of 1500 units)*

€1,420.54

(exc. VAT)

€1,747.26

(inc. VAT)

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  • Ready to ship from 22 June 2026
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Per Pack
Per unit*
1 +€1,420.54€0.947

*price indicative

RS Stock No.:
501-688
Distrelec Article No.:
304-62-874
Mfr. Part No.:
1-2199300-2
Manufacturer:
TE Connectivity
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Brand

TE Connectivity

Product Type

IC Socket

IC Socket Type

DIP

Number of Contacts

32

Current

1A

Number of Rows

2

Pitch

2.54mm

Orientation

Vertical

Contact Material

Phosphor Bronze

Contact Plating

Tin Lead

Socket Mount Type

Surface

Row Pitch

2.54mm

Minimum Operating Temperature

-40°C

Termination Type

Solder

Device Mount Type

Board

Maximum Operating Temperature

105°C

Standards/Approvals

UL 94 V-0

Housing Material

Polyester

COO (Country of Origin):
CN
The TE Connectivity DIP Socket is designed to ensure reliable performance in a variety of electronic applications. With a standard profile and 32 positions, it offers a robust solution for secure connections in printed circuit boards. The through-hole leg style allows for efficient soldering, making installation straightforward and reliable. Manufactured from high-quality materials, this socket withstands challenging environmental conditions, featuring an operating temperature range that suits industrial needs. Its sophisticated design includes dual leaf contacts for enhanced mating performance, ensuring durability and longevity. This product is ideal for engineers seeking dependable interconnect solutions, delivering both usability and advanced functionality to meet the demands of modern technology.

Optimised for vertical PCB mount orientation to maximise board layout efficiency

Crafted from durable polyester housing for excellent resistance to environmental stress

Features tin-lead sleeve plating for improved conductivity and reliability

Utilises dual leaf mating contact type to enhance connection security

Backed by compliance with stringent electrical standards for peace of mind

Packaging includes box and tube for convenient storage and handling

Designed for wave solder capabilities, ensuring seamless assembly processes