Molex 50238 Series Right Angle PCB Base Strip, 3 Contact(s), 1.25 mm Pitch, 1 Row

Subtotal (1 reel of 1200 units)*

€436.08

(exc. VAT)

€536.38

(inc. VAT)

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Reel(s)
Per Reel
Per unit*
1 +€436.08€0.363

*price indicative

RS Stock No.:
472-024
Mfr. Part No.:
502386-0371
Manufacturer:
Molex
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Brand

Molex

Product Type

Base Strip

Series

50238

Pitch

1.25mm

Current

1A

Number of Contacts

3

Housing Material

High Temperature Thermoplastic

Number of Rows

1

Orientation

Right Angle

Mount Type

PCB

Contact Plating

Gold

Contact Material

Copper Alloy

Minimum Operating Temperature

-40°C

Termination Type

Surface Mount

Row Pitch

1.25mm

Maximum Operating Temperature

105°C

Standards/Approvals

No

Voltage

50 Vrms

Distrelec Product Id

304-56-439

COO (Country of Origin):
MY
The TE Connectivity 1.25mm Pitch Wire-to-Board PCB Receptacle stands out with its innovative design, optimising connectivity and reliability. Engineered for high-performance applications, it facilitates seamless wire-to-board connections, simplifying installations while ensuring durability. The right-angle orientation offers flexibility in design, allowing it to fit in confined spaces without compromising functionality. Crafted from robust materials, including a copper alloy and high-temperature thermoplastic, this receptacle is built to withstand demanding environments. With gold plating for both mating and termination points, it guarantees exceptional signal integrity and long-lasting performance, making it an ideal choice for diverse electronic applications.

Compact design for efficient space utilisation

Right-angle orientation enhances installation versatility

Durable materials ensure long-term reliability

Gold plating minimises signal loss for superior performance

Suitable for various applications, including signal transmission

Utilises surface mount technology for streamlined assembly

High-temperature thermoplastic construction supports rigorous operational conditions

Compatible with multiple part housings for expanded applications

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